Method of forming encapsulation structure for organic light-emitting device

摘要

A method of forming an encapsulation structure for an organic light-emitting device is disclosed. The method is applied to organic light-emitting devices (OLED) and performed in a single reaction chamber. The method includes steps of placing an organic light-emitting device into a plasma chamber, forming a first buffer layer on the organic light-emitting device, forming a first passivation layer on the first buffer layer, forming a second buffer layer on the first passivation layer, and forming a second passivation layer on the second buffer layer.