发明名称 |
Preventive treatment method for a multilayer semiconductor wafer |
摘要 |
A preventive treatment method for a multilayer semiconductor wafer is described. The semiconductor wafer includes a supporting substrate, at least one intermediate layer and a surface layer in which an intermediate layer has an exposed lateral edge and the wafer is to be subjected to a subsequent treatment. The method includes encapsulating the exposed lateral edge of the intermediate layer with a portion of the surface layer to prevent attack on the peripheral edge during the subsequent treatment.
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申请公布号 |
US2004197963(A1) |
申请公布日期 |
2004.10.07 |
申请号 |
US20040784040 |
申请日期 |
2004.02.20 |
申请人 |
NEYRET ERIC;MALEVILLE CHRISTOPHE |
发明人 |
NEYRET ERIC;MALEVILLE CHRISTOPHE |
分类号 |
H01L21/762;(IPC1-7):H01L21/44;H01L21/48;H01L21/50;H01L21/823 |
主分类号 |
H01L21/762 |
代理机构 |
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主权项 |
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地址 |
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