| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition useful as an alkali developing type DFR (dry film resist) having properties of high resolution, favorable dispersion stability in a developing solution, low foaming property in an etching liquid, fast stripping time, and a fine form of stripped chips. <P>SOLUTION: The photosensitive resin composition contains: (a) a binder resin comprising a linear polymer having 100 to 600 acid equivalent of the carboxyl group content and having 20,000 to 500,000 weight average molecular weight; (b) a photopolymerizable unsaturated compound having a specified structure of higher alcohol containing both of an ethylene glycol chain and a propylene glycol chain; and (c) a photopolymerization initiator. A DFR is prepared from the photosensitive resin composition, and the DFR is used for manufacturing printed circuit boards, lead frames, semiconductor packages or the like. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
