| 摘要 |
PROBLEM TO BE SOLVED: To provide a plating device where the consumption of a plating liquid by its pumping is suppressed, and also, the load on the treatment of waste water containing the plating liquid is reduced. SOLUTION: In the plating device, a plating tank stored with a plating liquid, and in which a work mounted with the object to be plated is dipped, and plating is performed to the object to be treated, a plating liquid recovery tank in which the plating liquid stuck to the object to be treated is recovered, and a cleaning tank in which cleaning is performed to the object to be treated are arranged side by side, and the work is conveyed in the order of the plating tank, the plating liquid recovery tank, and the cleaning tank. The plating liquid recovery tank is provided with a dipping forbidden means where the dipping of the work into the plating liquid recovery tank is forbidden, and is further provided with an emergency dipping means where the work is dipped into the plating liquid recovery tank in case of the emergency stop of the conveyance of the work. Further, the work in the pretreatment tank for performing pretreatment to the plating provided on the prestage side in the plating tank is removed from the pretreatment tank in case of the emergency stop. COPYRIGHT: (C)2005,JPO&NCIPI
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