发明名称 |
Plating apparatus and plating method |
摘要 |
There is provided a plating apparatus and method which can control the temperature of a plating solution during plating more uniformly and easily form a uniform plated film on the to-be-plated surface of a workpiece, and which can simplify the device and decrease the footprint. The plating apparatus includes: a plating bath of a double bath structure (18) including an inner bath (14) for holding a plating solution and carrying out plating, and an outer bath (26) which surrounds the inner bath (14) and is in fluid communication therewith; and a heating device (30) disposed in the outer bath (26). The plating apparatus may further include means (32) for circulating or stirring the plating solution (12) in the plating bath (18).
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申请公布号 |
US2004197485(A1) |
申请公布日期 |
2004.10.07 |
申请号 |
US20040481437 |
申请日期 |
2004.05.07 |
申请人 |
WANG XINMING;ABE KENICHI;MISHIMA KOJI |
发明人 |
WANG XINMING;ABE KENICHI;MISHIMA KOJI |
分类号 |
C23C18/31;C23C18/16;H01L21/288;H01L21/768;(IPC1-7):B05D1/18;B05C3/00 |
主分类号 |
C23C18/31 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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