| 发明名称 |
Method of improving surface mobility before electroplating |
| 摘要 |
The present invention provides a method of improving surface mobility of a metal seed layer on a wafer before electroplating comprising applying a solvent to a surface of the metal seed layer.
|
| 申请公布号 |
US2004196697(A1) |
申请公布日期 |
2004.10.07 |
| 申请号 |
US20030407129 |
申请日期 |
2003.04.03 |
| 申请人 |
KO TED;TSAI MING-HSING |
发明人 |
KO TED;TSAI MING-HSING |
| 分类号 |
G11C11/34;H01L21/288;H01L21/3205;H01L21/768;(IPC1-7):G11C11/34 |
主分类号 |
G11C11/34 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
