发明名称 METHOD OF MOUNTING SEMICONDUCTOR DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To prevent "electrolytic corrosion" by solving the problem wherein the so-called "electrolytic corrosion" occurs, if several frames different in constituent materials are connected in low resistance with each other by any cause, in the case of contriving the reduction of noise by connecting by a grounding wire, the several frames of a motor and a controller for driving and controlling it with each other. <P>SOLUTION: This semiconductor device 3 is constituted by providing a shield plate 6 as a conductor and an insulation sheet 7 between itself and a controller frame 4, aiming at insulation between itself 3 and the controller frame 4 by the insulation sheet 7, and by connecting the shield plate 6 with a grounding wire 5, and installing both frames of the electric motor and the controller so that they are the same potential. Hereby, this system can prevent the occurrence of "electrolytic corrosion", as conventional. <P>COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2004282865(A) 申请公布日期 2004.10.07
申请号 JP20030069357 申请日期 2003.03.14
申请人 FUJI ELECTRIC SYSTEMS CO LTD 发明人 HITOTSUBASHI HIDEAKI
分类号 H02M7/48 主分类号 H02M7/48
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