| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a fixing method and equipment of an electronic component wherein moisture resistance and thermal stress resistance property can be improved by preventing the bonding material from over flowing and the thickness from changing. <P>SOLUTION: A solder feed mechanism 2, a shaping mechanism 3 which forms melting solder 6a by using a box type beat jig 3b, and a mount mechanism 4 which fixes a chip element 7 on the chip element fixing region 11 of a circuit board 10 (lead frame or the like) are arranged on the upper plate 1a of the temperature rising zone 1e side of a chamber 1 which is provided with the temperature rising zone 1e and a temperature falling zone 1f which are partitioned with a partition plate 1d, and the circuit board 10 is mounted on a lower plate 1b. The temperature rising zone 1e is made an H<SB>2</SB>/N<SB>2</SB>gas atmosphere, and the temperature falling zone 1f is made an N<SB>2</SB>gas atmosphere. Spacing of the upper plate 1a and the lower plate 1b of the chamber 1 is about 1 cm, and the circuit board 10 is set in the spacing. By forming the melting solder with the box type beat jig 3b, overflow of the solder is prevented, a superior fillet is obtained, the solder thickness is made uniform, and the moisture resistance and thermal stress resistance property are improved. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
