| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a non-solvent liquid silver paste formulation having high thermal conductivity and high reliabilty, formulation which does not contain a solvent, such as a viscosity modifier, since a low viscosity is achieved even in a silver paste containing a volume of silver powders, and to provide a semiconductor device using it. <P>SOLUTION: The formulation, which combines a liquid thermosetting resin and spherical silver powders, is characterized by having a viscosity of ≤10 Pas at 5 rpm at room temperature and a heat conductivity of ≥6 W/mK. The semiconductor device uses this formulation. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
