| 摘要 |
PROBLEM TO BE SOLVED: To provide a surface treatment method which efficiently forms a soldering area with high solder wettability and a non-soldering area with low or no solder wettability, manufacturing methods of an electronic component and a connector pin, and an electronic component. SOLUTION: In manufacturing the connector pin 1, a gold-plating layer 12 is formed on the surface of a nickel-plating ground layer 11, and a prescribed area is irradiated with a laser. This results in partial removal of the gold-plating layer 12 in the laser-irradiated area and formation of the non-soldering area 3 comprising a mixed layer 13 wherein gold and nickel are dispersed. Meanwhile, in other areas not irradiated with the laser, the gold-plating layer 12 remains intact to form the soldering area 2. COPYRIGHT: (C)2005,JPO&NCIPI
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