| 摘要 |
PROBLEM TO BE SOLVED: To provide a sputtering system capable of forming a film of uniform thickness at a high rate within a surface of a work. SOLUTION: A first shield 11 is disposed at an electrically insulatable distance from a backing plate 4 and a second shield 12, and a target T is fixed to the backing plate 4 so that a peripheral edge of the target is at an electrically insulatable distance from an inner peripheral edge of the first shield 11. Therefore, a space between the first shield 11 and the backing plate 4 and a space between the first shield and the target T function as an insulating layer. In addition, the first shield 11 is fitted to a chamber 1 via an insulating layer 9 formed of an insulator, and the first shield 11 is in a floating state thereby. COPYRIGHT: (C)2005,JPO&NCIPI
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