| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a combination IC card not generating faults and defects when the combination IC card is bent by external force or physically loaded by the external force by increasing the joining strength of the joining part of an antenna and an IC module and an IC card material and the IC module just by changing a part of members without changing a manufacture process or a module size as the combination IC card on which one IC module having a contact and non-contact response function is mounted. <P>SOLUTION: For the combination IC card, the joining part 11 of a non-contact antenna 2 and the IC module 3 provided inside a card substrate for the combination IC card 1 is formed by a grid-like antenna joining part pattern 12. At the opening part of a grid, the antenna formation sheet 23 of a lower layer and the core sheet of an upper layer are fused by thermal fusion. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
