发明名称 HEATING METHOD AND HEATING DEVICE, AND SOLDERING METHOD AND SOLDERING APPARATUS
摘要 <p><P>PROBLEM TO BE SOLVED: To secure the worked quality of a material to be worked by controlling an irradiating method and also, to prevent thermal damage to the material to be worked, when the material to be worked is worked by irradiating a plurality of positions in the material to be worked, such as soldering, with a light energy. <P>SOLUTION: A heating device is provided with a light source 2 for irradiating the material with the light energy, a positioning means 3 for guiding the light energy from the light source to the plurality of positions in the material to be worked and a control part 1 for controlling the positioning means 3 and the light source 2. When the plurality of positions in the material to be worked are continuously irradiated with the light energy corresponding to each position, the control part 1 controls the maximum temperature rising of the material to be worked to the heat resistance temperature or lower to prevent thermal damage to the material to be worked. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p>
申请公布号 JP2004276098(A) 申请公布日期 2004.10.07
申请号 JP20030073831 申请日期 2003.03.18
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 OU SEIHA;GOTO YASUHIRO;WATANABE YASU;FUJII KOJI
分类号 B23K26/00;B23K1/005;B23K101/36;H05K3/34;(IPC1-7):B23K1/005 主分类号 B23K26/00
代理机构 代理人
主权项
地址
您可能感兴趣的专利