| 摘要 |
PROBLEM TO BE SOLVED: To improve productivity while retaining a high yield, in the lamination pressing process of manufacture of a multilayer flexible printed wiring board. SOLUTION: The manufacturing method of the multilayer flexible printed wiring board is constituted of the manufacturing process of the multilayer flexible printed wiring board comprising a process, wherein an inner layer flexible circuit board, a copper clad laminate for the flexible printed wiring board, a flexible circuit substrate, and an interlayer bonding sheet excluding either one or more of copper foil as well as a part which becomes unnecessary after lamination are heated, pressurized and laminated; and the process of after curing of the interlayer bonding sheet after lamination. In the manufacturing method, a border line between an unnecessary part and a necessary part after laminating the interlayer bonding sheet is projected toward the necessary part when it is seen from the unnecessary part and when an angle consisting of a point of intersection between two border lines is not larger than 45°, the corner is chamfered by an arc having a diameter of not shorter than 1mm. COPYRIGHT: (C)2005,JPO&NCIPI |
