| 摘要 |
PROBLEM TO BE SOLVED: To perform work easier after a packing component is removed from a jig which performs solder printing on the electrode of the packing component after solder printing. SOLUTION: In the bottom of the recess 11 of the jig 10, an opening 11a is formed to expose ball electrodes provided on the bottom surface of the package of a BGA 23. After the BGA 23 is inserted into the recess 11 of the jig 10, a printing mask is put on the bottom surface of the package of the BGA 23 exposed through the opening 11a after the package is turned upside down by pressing the top surface of the package by means of a leaf spring 14 and solder printing is performed. Then, after the top surface of the package is brought to the upside by turning the package upside down again, the BGA 23 is taken out of the recess 11 by vacuum tweezers etc. COPYRIGHT: (C)2005,JPO&NCIPI
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