发明名称 |
HEATING CONTROL STRUCTURE OF MOLD UNIT |
摘要 |
PROBLEM TO BE SOLVED: To provide a mold unit which is used for injection molding or the like and can control the temperature of a molten resin with high accuracy without complicating the mold structure and without increasing the mold cost. SOLUTION: The mold unit has a heat conduction layer L which is arranged between heating members 41, 42 and a member 20 to be heated wherein heating members 41, 42 are embedded. The heat conduction layer L is composed of a first heat conduction layer L1 installed closely to the heating members 41, 42 and a second heat conduction layer L2 which has a heat conductivity lower than that of the first heat conduction layer L1 and is installed between the first heat conduction layer L1 and the member 20. Either the first heat conduction layer L1 or the second heat conduction layer L2 is kept in contact with the member 20. COPYRIGHT: (C)2005,JPO&NCIPI
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申请公布号 |
JP2004276571(A) |
申请公布日期 |
2004.10.07 |
申请号 |
JP20030091755 |
申请日期 |
2003.03.28 |
申请人 |
MITSUBISHI MATERIALS CORP |
发明人 |
TAKEISHI ATSUSHI;WADA MASAHIRO |
分类号 |
B29C33/02;(IPC1-7):B29C33/02 |
主分类号 |
B29C33/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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