发明名称 HEATING CONTROL STRUCTURE OF MOLD UNIT
摘要 PROBLEM TO BE SOLVED: To provide a mold unit which is used for injection molding or the like and can control the temperature of a molten resin with high accuracy without complicating the mold structure and without increasing the mold cost. SOLUTION: The mold unit has a heat conduction layer L which is arranged between heating members 41, 42 and a member 20 to be heated wherein heating members 41, 42 are embedded. The heat conduction layer L is composed of a first heat conduction layer L1 installed closely to the heating members 41, 42 and a second heat conduction layer L2 which has a heat conductivity lower than that of the first heat conduction layer L1 and is installed between the first heat conduction layer L1 and the member 20. Either the first heat conduction layer L1 or the second heat conduction layer L2 is kept in contact with the member 20. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2004276571(A) 申请公布日期 2004.10.07
申请号 JP20030091755 申请日期 2003.03.28
申请人 MITSUBISHI MATERIALS CORP 发明人 TAKEISHI ATSUSHI;WADA MASAHIRO
分类号 B29C33/02;(IPC1-7):B29C33/02 主分类号 B29C33/02
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