| 摘要 |
PROBLEM TO BE SOLVED: To provide a chuck device which prevents defocusing of a pattern on a wafer by correctly keeping levelness of the wafer even when foreign substances are attached to a rear of the wafer when the wafer is mounted on a stage, and to provide an exposure system and a method for manufacturing a semiconductor device. SOLUTION: The chuck device is provided for adsorbing and fixing the wafer 11 on the stage 12. A plurality of pins 121 of a certain height, each end of which having a round shape, eg. a spherical surface, are formed at a predetermined pitch throughout the entire surface of the stage 12. The spherical surface of each pin 121 provides a smaller area that is in contact with the wafer 11, which in turn provides a low possibility of being in contact with foreign substances. In the case where rotatable spherical pins are arranged, the wafer 11 is slid with the rotation of the spherical pins and thus the foreign substances are shifted from the pins. COPYRIGHT: (C)2005,JPO&NCIPI |
