| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device which can be thinned, realizes easy mutual connection of substrates and has high connection reliability. SOLUTION: The semiconductor device comprises a first substrate 12 with a plurality of first electrodes 11, a second substrate 20 with a plurality of second electrodes 21a and a third substrate 22 with a plurality of third electrodes 23. In the semiconductor device, the first substrate 12 and the third substrate 22 are adhered with resin, and the first electrode 11 and the third electrode 23 are opposed and electrically connected via a bump 19. The second substrate 20 is disposed in a space part provided between the first substrate 12 and the third substrate 22. The first electrode 11 and the second electrode 21a are electrically connected via a bump 21b. COPYRIGHT: (C)2005,JPO&NCIPI |
