发明名称 Leistungshalbleiteranordnung in modularer Bauart
摘要 An IGBT unit of a power semiconductor module which comprises a plurality of insulation substrates each of which mounting a plurality of semiconductor devices thereon which are to be operated in parallel within the module is provided. External terminals corresponding to each unit are disposed outside the module for parallel operation thereof, thereby minimizing inductance between respective semiconductor devices and their wirings. <IMAGE>
申请公布号 DE69726518(T2) 申请公布日期 2004.10.07
申请号 DE1997626518T 申请日期 1997.09.02
申请人 HITACHI, LTD.;HITACHI KYOWA ENGINEERING CO., LTD. 发明人 TANAKA, AKIRA;INOUE, HIROKAZU;KUSHIMA, TADAO;KOIKE, YOSHIHIKO;SHIMIZU, HIDEO;SAITO, RYUICHI;SUZUKI, KAZUHIRO;KURIHARA, YASUTOSHI;OKADA, SENSUKE;KOIZUMI, MASAHIRO;KAJIWARA, RYOICHI;SONOBE, YUKIO;NAKATSU, KINYA;KURIBAYASHI, SHIGEHISA
分类号 H01L23/498;H01L23/538;H01L25/07;H02M7/00 主分类号 H01L23/498
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