| 摘要 |
<p>Reactive one-part hot melt epoxy adhesive formulations, and methods of using the same, are described. The formulations include at least one epoxy resin, at least one tackifier, and at least one latent curing agent, and exhibit relatively good thermal stability, high lap shear strength, high T-peel strength, and adhere to a wide range of substrates. The formulations are especially suitable for use in joining automotive components that are subjected to paint oven or electrodeposition oven treatment.</p> |
