发明名称 POSITIVE PHOTOSENSITIVE COMPOSITION
摘要 <P>PROBLEM TO BE SOLVED: To provide an alkali-soluble positive photosensitive composition having sensitivity to laser light in an IR wavelength region, and to provide a positive photosensitive composition which gives sufficient adhesiveness when applied under conditions of 25 to 60% humidity in the work room without requiring burning, which can be developed with high sensitivity, no residue and a sharp profile of a cut pattern, which results in an extremely high resist film and improved scratch resistance before development. <P>SOLUTION: The positive photosensitive composition contains: an alkali-soluble organic polymer substance having a phenolic hydroxyl group or containing an epoxy resin with which a phenolic hydroxyl group is made to react; a photo-thermal conversion substance which has an absorption band in a part or the entire IR ray region at 700 to 1,100 nm wavelength and which absorbs IR rays of an image exposure light source to convert the rays into heat; and a ketone resin. <P>COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2004279555(A) 申请公布日期 2004.10.07
申请号 JP20030068264 申请日期 2003.03.13
申请人 THINK LABORATORY CO LTD 发明人 SATO TSUTOMU
分类号 G03F7/004;G03F7/00 主分类号 G03F7/004
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