| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a wiring board in which impedance matching of the entire signal transmission passage between pads on the surface and rear of a board can be realized easily at a desired signal frequency through a line conductor and a through hole conductor or a via for signal formed on a flat core. <P>SOLUTION: In a wiring board 1, a metal terminal pad 10, 110, 17, 117 comprises a Cu plating layer 52, an Ni plating layer 53 and an Au plating layer 54 formed sequentially from the first major surface CP side wherein the Ni plating layer 53 is an electrolytic Ni plating layer 53. On the first major surface CP of a dielectric layer 6 becoming a pad forming surface, metal wiring having one end connected with the metal terminal pad 10, 110, 17, 117 is not arranged or the other end side of metal wiring 77 is connected with an inner layer conductor layer 7 through a via 34. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
