| 摘要 |
PROBLEM TO BE SOLVED: To electrically connect connecting pads of a wiring board to the terminal pads of an external electric circuit board with high connection reliability via conductor bumps. SOLUTION: In the wiring board 5 in which wiring conductors 2 are formed inside an insulating substrate 1 and many connecting pads 3 are formed on a main surface, the connecting pads consist of first connecting pads 3a formed into a quadrangular frame arrangement along the circumference of the insulating substrate 1, and second connecting pads 3b formed into a grid arrangement in a quadrangular region in the center of the insulating substrate 1. Elliptic dummy pads 4 for reinforcement each having longitudinal direction pointing the center of the insulating substrate 1 are provided on the main surface of the insulating substrate 1 on a portion between connecting pads positioned at corners of the quadrangular arrangement of the first connecting pads 3a and the connecting pads positioned at outermost corners of the grid arrangement among the second connecting pads 3b. The dummy pads 4 can efficiently reinforce the connection between the board 5 and external electric circuit board. COPYRIGHT: (C)2005,JPO&NCIPI
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