| 摘要 |
PROBLEM TO BE SOLVED: To obtain a multilayer interconnection board for preventing fail from occurring in the insulation between wiring circuit layers, when a flaw on a board surface by blast treatment or the like causes the infiltration of water in plating treatment and a high humidity atmosphere in the multilayer interconnection board incorporating an insulating layer whose thickness is 70μm or thinner at least inside. SOLUTION: In a ceramic multilayer interconnection board 1, the wiring circuit layer 3 is formed on the surface and inside of an insulating board 2, where a plurality of insulating layers 2a-2i including the thin insulating layer of at least 70μm or thinner are laminated. In this case, the thickness of the insulating layers 2a, 2i at an outermost surface side where the surface wiring circuit layer 3 is formed is set to 75μm or thicker. Especially, a plating layer 6 whose thickness is 1-20μm is formed in the surface wiring circuit layer 3. Furthermore, the multilayer interconnection board is ideal when a sheet hard to be sintered is laminated on the surface of a forming body for burning before the sheet hard to be sintered is removed for manufacturing a wiring board having high precision in dimensions. COPYRIGHT: (C)2005,JPO&NCIPI |
