| 摘要 |
PROBLEM TO BE SOLVED: To reduce occurrence of defective scribing and breaking and damage to a circuit in scribing and breaking a liquid crystal display panel. SOLUTION: A wafer is diced in such a way that specified thickness is left on a spot, of both surfaces of the wafer, to be subjected to scribing and breaking. An adhesive film is not stuck to a surface to be scribed and broken but stuck to a surface opposite to the surface to be scribed and broken. Subsequently the wafer is placed on a scribing and breaking table which has been paved with an elastic sheet and a porous sheet in this order and the wafer is scribed and broken by being vertically pressed with an elastic squeegee. COPYRIGHT: (C)2005,JPO&NCIPI
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