| 摘要 |
PROBLEM TO BE SOLVED: To provide a package for a piezoelectric device and the piezoelectric device which alleviates bending stress caused on the package to maintain its sufficient mounting strength when the piezoelectric device is miniaturized and made thinner. SOLUTION: In the package 12 for the piezoelectric device, a pair of external electrodes 30 mounted on a board (not diagramed) are arranged on the outer surface of a bottom 16 which is a component of the package 12. When the length of the outer surface of the bottom 16 in the arranging direction of the external electrodes 30 is L, an arrangement space of the electrodes 30 is smaller than 0.53 L. A cutout is formed at the outside on the center of each electrode 30, and has an opening width w of 0.3a to 0.45a when the length of the electrode 30 (in the direction perpendicular to the drawing) is (a). COPYRIGHT: (C)2005,JPO&NCIPI
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