| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat dissipation sheet fixing mechanism capable of stably fixing a heat dissipation sheet at low costs and improving heat radiation properties. SOLUTION: In a fixing mechanism for fixing the heat dissipation sheet 10 for dissipating heat in an electronic component 3 onto an external surface of the electronic component 3 packaged on a substrate 2, pressing means 5, 6 for elastically pressing the heat dissipation sheet 10 to the electronic component 3 are provided on the substrate 2 or in a case 1 for accommodating the substrate 2, and a press dispersion means 4 for dispersing the press of the pressing means 5, 6 is provided between the press means 5, 6 and the heat dissipation sheet 10, thus adhering the heat dissipation sheet 10 to the electronic component 3 and pressing the heat dissipation sheet 10 onto the electronic component 3 by the press of the pressing means 5, 6 for stably fixing. COPYRIGHT: (C)2005,JPO&NCIPI
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