| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board exhibiting high reliability of electrical connection to an external electric circuit board in which a connection pad can be electrically connected with a terminal pad of the external electric circuit board surely over a long term through a conductor bump, and that connection can be secured even if a stress due to difference of thermal expansion coefficient between an insulating substrate and the external electric circuit board is increased. SOLUTION: A wiring conductor 2 is formed in a square insulating substrate 1 of ceramics, and a large number of connection pads 3 connected electrically with the wiring conductor 2 are arranged longitudinally and latitudinally in a square region on one major surface of the insulating substrate 1 of a wiring board 5. Connection pads 3 located at the outermost circumferential corners of arrangement are composed of a metallized conductor applied to the inner wall of a through hole 4 made from one major surface to the other major surface of the insulating substrate 1. Since thermal stress can be relaxed effectively by the connection pads 3a located closely to the corner parts of the insulating substrate 1 where thermal stress acts significantly, a wiring board 5 exhibiting high reliability of electrical connection can be attained. COPYRIGHT: (C)2005,JPO&NCIPI
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