RESIN FILM, LAMINATE, PRINTED WIRING BOARD USING THE SAME AND ITS MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a resin film excellent in adhesiveness though the surface roughness of the resin film is smaller than before, enabling formation of fine wiring, enhanced in heat resistance and suitably usable for manufacturing a circuit board such as a flexible printed wiring board (FPC), a build-up circuit board or the like. SOLUTION: This resin film has a surface shape characterized in that the value Ra1 of at least one side of the film measured on the basis of a cut-off value of 0.002 mm of arithmetic average roughness is 0.05-1μm and a ratio Ra1/Ra2 of the value Ra1 and a value Ra2 measured on the basis of a cut-off value of 0.1 mm is 0.4-1. COPYRIGHT: (C)2005,JPO&NCIPI