<p>A semiconductor assembly comprises a support layer, a first integrated circuit and a second integrated circuit. The support layer comprises a first side and a second side. The first side comprises a set of contact pads. The second side comprises a set of predefined areas. The set of predefined areas comprises a main predefined area and a plurality of auxiliary predefined areas. Each auxiliary predefined area comprises a connection hole. A connection hole is connected to a contact pad. The first integrated circuit comprises at least one connection pad connected to at least one auxiliary area with connecting means. The second integrated circuit comprises at least one connection pad connected to at least one auxiliary area with connecting means. The second integrated circuit is located onto the main predefined area.</p>
