| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an electrolytic machining liquid reducing a polishing speed of copper, which is a wiring layer, up to at least a speed equivalent to that of a barrier layer and capable of planarizing the surface of a copper film flush with the surface of an insulating layer at electrolytic polishing time of a surface of a substrate. <P>SOLUTION: An electrolytic machining liquid of the present invention functions to planarize the surface of a substrate through subjecting at least either of a barrier layer formed on the substrate or a wiring layer mainly composed of copper to electrolytic polishing, and such an electrolytic machining liquid comprises either of alkaline solution or fluorine series solution and inhibitor. The inhibitor is absorbed by the surface of the copper, thereby suppressing the copper from dissolving as ions. Dissolution of copper is selectively accelerated in a part from which the inhibitor absorbed by the surface is removed by polishing, thereby preferentially removing wiring layers from a projection part, and accelerating the planarization in a process of electrolytic polishing. In addition, the electrolytic polishing is further preferably conducted if an oxidizing agent and abrasive grains are included. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
