| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a laser marking device for a semiconductor device which can efficiently execute marking without positional deviations even if the warpage of a semiconductor substrate caused by the contraction of a resin occurs, and a marking method. <P>SOLUTION: The marking device for the semiconductor device is provided with an image recognition means 18 which recognizes the warpage of the semiconductor substrate. A controller 17 divides a plurality of semiconductor elements into blocks on the basis of the degree of the warpage. It calculates coordinates of the individual semiconductor elements. Printing is executed for every block. As a result, it is possible to enhance the accuracy of the marking positions. The printing without the deviations can be executed corresponding to the warpage of the semiconductor substrate. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
