发明名称 Thermosetting composition, and sealing article and sealing structure using the same
摘要 A sealing article and sealing structure are described that include a thermosetting composition. The thermosetting composition includes an epoxy-containing material, a curing agent for the epoxy-containing material, a non-metallic filler, and a plasticizer. The epoxy-containing material includes a how hygroscopic epoxylated ethylene-type thermoplastic resin or a low hygroscopic epoxylated styrene-type thermoplastic resin.
申请公布号 US2004197571(A1) 申请公布日期 2004.10.07
申请号 US20030406175 申请日期 2003.04.03
申请人 HIROSHIGE YUJI;KITANO SHUICHI;KOIWA TOMOHIRO;SHINOZAKI KOTARO 发明人 HIROSHIGE YUJI;KITANO SHUICHI;KOIWA TOMOHIRO;SHINOZAKI KOTARO
分类号 B32B27/38;B60R13/06;B60R13/07;C08G59/34;C08G59/38;C09K3/10;(IPC1-7):B32B27/00 主分类号 B32B27/38
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