发明名称 |
Thermosetting composition, and sealing article and sealing structure using the same |
摘要 |
A sealing article and sealing structure are described that include a thermosetting composition. The thermosetting composition includes an epoxy-containing material, a curing agent for the epoxy-containing material, a non-metallic filler, and a plasticizer. The epoxy-containing material includes a how hygroscopic epoxylated ethylene-type thermoplastic resin or a low hygroscopic epoxylated styrene-type thermoplastic resin.
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申请公布号 |
US2004197571(A1) |
申请公布日期 |
2004.10.07 |
申请号 |
US20030406175 |
申请日期 |
2003.04.03 |
申请人 |
HIROSHIGE YUJI;KITANO SHUICHI;KOIWA TOMOHIRO;SHINOZAKI KOTARO |
发明人 |
HIROSHIGE YUJI;KITANO SHUICHI;KOIWA TOMOHIRO;SHINOZAKI KOTARO |
分类号 |
B32B27/38;B60R13/06;B60R13/07;C08G59/34;C08G59/38;C09K3/10;(IPC1-7):B32B27/00 |
主分类号 |
B32B27/38 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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