| 摘要 |
<p>A printed wiring board in which at least a first conductive layer (2), an electrical insulating layer (3), and a second conductive layer (4) are laminated in order of mention on an inner layer sheet (1), and the electrical insulating layer satisfies the conditions (1) to (3) below. (1) The surface roughness Ra of the surface in contact with the second conductive layer is 300 nm or less. (2) The electrical insulating layer contains a filler. (3) Letting the thickness of the electrical insulating layer in the cross section drawn when the printed wiring board is cut vertically be h1, the distance between the conductive layers in the cross section be h2, the region from the surface of the inner layer sheet to 80% of h1 toward the second conductive layer be region A, the region from the surface of electrical insulating layer in contact with the second conductive layer to 5% of h2 toward the inner layer sheet be region B, and the region between region A and region B be region C, a>=c>b and 0.1>(b/a)>=0 where a, b, and c are the specific surfaces of the filler having diameters of 50 nm or more contained per unit area in regions A, B, C, repetitively. According to the invention, a printed wiring board having a high adhesion between an electrical insulating layer and a conductive layer is provided.</p> |
