| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an inexpensive and easy-to-manufacture electronic circuit unit which can be mounted by means of a mounter while preventing the breakage of the wire of a semiconductor bare chip, and to provide its manufacturing method. <P>SOLUTION: The electronic circuit unit comprises a substrate 1 on which a wiring pattern is formed, an electronic component including a semiconductor bare chip 2 arranged on the surface 1a of the substrate 1, and a sealing resin 4 provided on the surface of the substrate 1 to cover the electronic component. The wire 3 of the semiconductor bare chip 2 is connected with the wiring pattern and covered with soft sealing resin 4 and a protective member 5 formed of resin harder than the sealing resin 4 has an upper wall 5b provided with a flat outer surface 5a and a leg 5c extending from the upper wall 5b to the substrate side wherein the leg 5c is bonded to the substrate 1 while covering the sealing resin 4 with the protective member 5. Even if an external force is applied, the protective member 5 does not crack but protects the sealing resin 4 thus eliminating the breakage of the wire 3. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
