PRESSURE-WELDING SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To obtain the pressure-welding semiconductor device of a simple structure by omitting a spring mechanism for obtaining prescribed contact pressure without pressure from outside of the pressure-welding type semiconductor device.

SOLUTION: Air in a sealed container constituting the pressure-welding semiconductor device is exhausted to lower pressure in this container to a negative pressure lower than atmospheric pressure. Thus, upper and lower external electrodes are pressurized by the atmospheric pressure to contact with the electrode of a semiconductor element inside.

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