发明名称 METHOD OF MANUFACTURING COMPONENT INCORPORATING MODULE
摘要 PROBLEM TO BE SOLVED: To provide a method of manufacturing a circuit component incorporating modules, which has high continuity quality, high density and smoothness by providing a cavity for embedding an active component and a passive component inside the laminated electric insulating sheets, using the electric insulating sheets each consisting of mixture containing an inorganic filler and a thermosetting resin. SOLUTION: Sheets (6a-6f) each including a half-cured thermosetting resin are used as the electric insulating sheets. Before disposing a component (3) inside the electric insulating sheets, the cavity (9) is formed having a shape conforming to the shape of the component (3), the component (3) is disposed in the cavity (9). After that, the half-cured sheet is subjected to heating and pressurizing to be cured and fill the gap of the cavity (9). COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2004281466(A) 申请公布日期 2004.10.07
申请号 JP20030067155 申请日期 2003.03.12
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 TANIGUCHI HIROSHI;HAYASHI YOSHITAKE;YUHAKU SEI
分类号 H01L23/12;(IPC1-7):H01L23/12 主分类号 H01L23/12
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