发明名称 APPARATUS FOR THERMOMECHANICAL ANALYSIS
摘要 PROBLEM TO BE SOLVED: To provide an apparatus for thermomechanical analysis capable of measuring accurately a thermal expansion coefficient or the like without requiring a troublesome calibration work by measuring the temperature of a sample itself without exerting an influence on analysis. SOLUTION: A hot contact 73 comprising a thin plate-shaped thermocouple material having the thickness of 0.1 mm or below and a hot contact of a thermocouple comprising a wire lead part 72 from a wire lead having the diameter of 0.15 mm or below are brought into surface contact with a sample S on an orthogonal plane to a detection rod 2. The contact position is between the detection rod 2 and the sample S, between the sample S and a sample stand 9 or between two portions formed by halving the sample S. Analysis while measuring directly the sample temperature is enabled without being influenced by the thermocouple by the surface contact in this way. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2004279074(A) 申请公布日期 2004.10.07
申请号 JP20030067644 申请日期 2003.03.13
申请人 SHIMADZU CORP 发明人 NISHINO KOJI
分类号 G01N25/16;(IPC1-7):G01N25/16 主分类号 G01N25/16
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