发明名称 |
Method and apparatus for reduction of defects in wet processed layers |
摘要 |
The present invention provides a method and apparatus for wet processing of a conductive layer using a degassed process solution such as a degassed electrochemical deposition solution, a degassed electrochemical polishing solution, a degassed electroless deposition solution, and a degassed cleaning solution. The technique includes degassing the process solution before delivering the degassed process solution to a processing unit or degassing the process solution in-situ, within the processing unit.
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申请公布号 |
US2004198190(A1) |
申请公布日期 |
2004.10.07 |
申请号 |
US20030425782 |
申请日期 |
2003.04.29 |
申请人 |
BASOL BULENT M;UZOH CYPRIAN E |
发明人 |
BASOL BULENT M;UZOH CYPRIAN E |
分类号 |
B24B37/04;B24B57/02;C23C18/16;C25D7/12;C25D21/04;H01L21/288;(IPC1-7):B24B1/00 |
主分类号 |
B24B37/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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