LAMINATE PANEL HAVING DOUBLE-SIDED METAL LAYER WITH EXCELLENT INTERLAYER ADHESION AND MANUFACTURING METHOD THEREOF

摘要

PURPOSE: Provided is a laminate panel for circuit boards, which has high density and excellent flexibility and heat resistance, prevents the problem of curling, and shows excellent interlayer adhesion without using any separate adhesive. CONSTITUTION: The laminate panel having double-sided metal layer comprises: a metal layer(1) on one surface; a layer(2) formed of polyimide resin for improving adhesion to the metal; a layer(3) formed of a low heat-expandable polyimide resin having a heat expansion coefficient of 5X10¬-6 to 2.5X10¬-5/deg.C; a layer(4) formed of a thermoplastic polyimide resin; and another metal layer(5) on the other surface. The metal layers is preferably formed of copper.