| 摘要 |
<p>A resist film and a bonding layer are disposed between a sensor substrate and a PCB, and a cutout is formed in the resist film and the bonding layer at the part where the through hole of the sensor substrate communicates with the through hole of a PCB to form an air vent communicating with the outside of the edge part of the laminated substrates. When the conductive material is filled in the through hole from the obverse surface of the sensor substrate, the air in the through hole is released from the air vent to thereby reliably fill the conductive material in the through hole, which can reliably bring the electrode and the land 28 into conduction.</p> |
