发明名称 High density patch panel
摘要 <p>A patch panel (20) is disclosed. The patch panel (20) includes a frame (22), a faceplate (24) mountable into a rear side of the frame (22), and at least one modular jack (26) mountable into a rear side of the faceplate (24). The frame (22) has a plurality of faceplate openings (38), and the faceplate (24) has a plurality of modules (56, 58, 60, 62). Each module (56, 58, 60, 62) has at least one modular jack retention latch (64, 66). A method for assembling a patch panel is also disclosed. <IMAGE></p>
申请公布号 EP1465438(A1) 申请公布日期 2004.10.06
申请号 EP20040252005 申请日期 2004.04.02
申请人 PANDUIT CORPORATION 发明人 CAVENEY, JACK E.;DONNELL, MARK J.
分类号 H01R13/74;H04Q1/02;H01R13/514;H01R13/518;H04Q1/14;(IPC1-7):H04Q1/14 主分类号 H01R13/74
代理机构 代理人
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