METAL PAD OF SEMICONDUCTOR DEVICE TO IMPROVE THICKNESS UNIFORMITY OF INTERLAYER DIELECTRIC

摘要

PURPOSE: A metal pad of a semiconductor device is provided to improve thickness uniformity of an interlayer dielectric and focus margin by controlling the density of the metal pad in accordance with a pattern density in a chip. CONSTITUTION: A vacancy(20) is formed in a metal pad(30) used for probing test or wiring. At this time, the density of the vacancy is controlled identically with a pattern density of the same metal film as the metal pad. Also, the vacancy is not overlapped with the stacked metal pad.