METHOD FOR PACKAGING FLIP CHIP TO IMPROVE PERFORMANCE OF CONNECTION

摘要

PURPOSE: A method for packaging a flip chip to improve connection is provided to improve the performance of connection by forming bumps on both sides of a chip and a substrate. CONSTITUTION: A stud bump is formed on a wafer(S2). A tape is adhered on one side of the wafer(S3). The wafer is cut in chip unit(S4). A bump is formed on a substrate pad(S9). A flip chip bonding process is performed to adhere a stud bump of a chip pad on a bump of the substrate pad by using heat and ultrasonic waves(S5). A lid is installed on a ceramic package and a sealing process is performed to seal up a gap between the lid and the ceramic package. A connection space between a flip chip and the main board is filled with resin(S6).