| 发明名称 |
A heat sink for electronic components |
| 摘要 |
A heat sink for electronic components comprises heat dissipating means (3) connected to at least one electronic component (5) and ventilation means (7) designed to supply the heat dissipating means (3) with air. The dissipating means (3) comprise at least one thermally conductive plate (9) connected to the electronic component (5) and having a plurality of openings (11). <IMAGE> |
| 申请公布号 |
EP1253638(A3) |
申请公布日期 |
2004.10.06 |
| 申请号 |
EP20020425252 |
申请日期 |
2002.04.22 |
| 申请人 |
AAVID THERMALLOY S.R.L. |
发明人 |
CAPRIZ, CESARE;PATEL, ASHOCK |
| 分类号 |
H01L23/433;H01L23/467;(IPC1-7):H01L23/467;H01L23/367 |
主分类号 |
H01L23/433 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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