| 发明名称 |
SEMICONDUCTOR MANUFACTURING APPARATUS WITH PEELING-OFF MECHANISM CAPABLE OF REMOVING STABLY ADHESIVE TAPE FROM SEMICONDUCTOR CHIPS AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE |
| 摘要 |
PURPOSE: A semiconductor manufacturing apparatus and a method of manufacturing a semiconductor device are provided to restrain the failure of a semiconductor chip by peeling off an adhesive tape from the chip while adsorbing stably the chip. CONSTITUTION: A semiconductor manufacturing apparatus includes a peeling-off mechanism. The mechanism is used for peeling off an adhesive tape(24) from a plurality of semiconductor chips(1). The mechanism includes an adsorbing portion for adsorbing the semiconductor chips during the process of peeling off the adhesive tape. The adsorbing portion is composed of at least two adsorbing regions. Each adsorbing region is made of a porous substance. |
| 申请公布号 |
KR20040084794(A) |
申请公布日期 |
2004.10.06 |
| 申请号 |
KR20040020176 |
申请日期 |
2004.03.25 |
| 申请人 |
KABUSHIKI KAISHA TOSHIBA;LINTEC CORPORATION |
发明人 |
KUROSAWA TETSUYA;TAKYU SHINYA;MOCHIDA KINYA;WATANABE KENICHI |
| 分类号 |
H01L21/60;H01L21/00;H01L21/68;(IPC1-7):H01L21/60 |
主分类号 |
H01L21/60 |
| 代理机构 |
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代理人 |
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