System for temperature compensation of thermally loaded bodies having a low heat conductivity, especially of supports for reflective layers or substrates in optics,申请号EP20010118865-传众专利搜索

发明名称	System for temperature compensation of thermally loaded bodies having a low heat conductivity, especially of supports for reflective layers or substrates in optics
摘要
申请公布号	EP1197776(B1)	申请公布日期	2004.10.06
申请号	EP20010118865	申请日期	2001.08.16
申请人	CARL ZEISS SMT AG	发明人	DIEKER, THOMAS
分类号	G02B7/182;G02B7/18;G03F7/20;H01L21/02;H01L21/027;(IPC1-7):G02B7/18	主分类号	G02B7/182
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