METHOD OF MANUFACTURING ELECTRONIC COMPONENT FOR REUSING CONDUCTIVE PARTICLES REMAINING ON MASK AND SECURING ELECTRICAL CONNECTION BETWEEN ELECTRONIC COMPONENT AND CORRESPONDING SUBSTRATE, ELECTRONIC COMPONENT, METHOD OF MOUNTING ELECTRONIC COMPONENT AND ELECTRONIC APPARATUS

摘要

PURPOSE: A method of manufacturing an electronic component, the electronic component, a method of mounting the electronic component and an electronic apparatus are provided to reuse conductive particles remaining on a mask by peeling off the mask after removing the conductive particles from the mask and to secure electrical connection between the electronic component and a corresponding substrate by forming a bump lower than the mask. CONSTITUTION: A plurality of electrode pads are formed on an active surface of a wafer(4). A mask(70) with openings for exposing the electrode pads to the outside is formed on the wafer. A bump(44) is formed on each electrode pad through the opening. At this time, the bump is lower than the mask. Conductive particles(50) are distributed thereon. Owing to the lower height of the bump compared to the mask, almost all the conductive particles remain on the bump. Few conductive particles for reuse are previously removed from the mask. The mask is then removed therefrom.