发明名称 IC CARD EMBEDDING WITH IC CHIP
摘要 PURPOSE: An IC card embedding with an IC chip is provided to lessen stress applied to an FPC(Flexible Printed Circuit board) and the IC chip, and prevent breakage of the IC card. CONSTITUTION: The IC chip(2) and other electronic parts(3) are mounted on an upper side of the FPC(1). An electric insulation plate part(1a) more solid than the FPC is attached to a lower side of the FPC. The plate part prevents the FPC from being elastically transformed when the IC chip is mounted on the FPC. The FPC is divided into multiple sectors arranged on the same plane. The sectors are electrically connected through electric wiring(4) such as a flat cable. The FPC including the IC chip and the electronic parts is covered with an electric insulation hard part(5), and the electric wiring is covered with a soft part(6).
申请公布号 KR20040084833(A) 申请公布日期 2004.10.06
申请号 KR20040020369 申请日期 2004.03.25
申请人 DENSO CORP. 发明人 MARUYAMA TERUTAKA;NAKAGAWA MITSURU
分类号 B42D15/10;G06K19/07;G06K19/077;H05K1/02;H05K1/18;H05K3/00;H05K3/28;(IPC1-7):G06K19/07 主分类号 B42D15/10
代理机构 代理人
主权项
地址