发明名称 Semiconductor device and method of manufacturing the same
摘要 There is provided a method of manufacturing a semiconductor device, including forming a structure including a first layer containing Si and a metal oxide layer in contact with the first layer, the metal oxide layer having a dielectric constant higher than that of silicon oxide, and heating the structure in an atmosphere containing He and/or Ne.
申请公布号 US6800519(B2) 申请公布日期 2004.10.05
申请号 US20020241456 申请日期 2002.09.12
申请人 KABUSHIKI KAISHA TOSHIBA 发明人 MURAOKA KOUICHI;KURIHARA KAZUAKI
分类号 H01L21/28;H01L29/51;(IPC1-7):H01L21/823;H01L21/320;H01L29/76 主分类号 H01L21/28
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